Low-shrink compounds offer superior flexibility and environmental resistance. Adhesive solders form conductive paths without damage from heating.
 
     
 
PRODUCT RANGES DESCRIPTION ORDERING INFO
Package / Size Stock Number Dispenser Number Nozzle Number
2 Ton® Clear Epoxy Extremely strong, medium-cure, water-resistant adhesive. 25 ml Dev-Tube™ 14310 - -
50 ml catridge 14260 14280 (manual)
14275 (pneumatic)
14285

14285
400 ml catridge 14355

14410 (manual)
14400 (pneumatic)

14292

14292
9 pounds 14360 - -
10 gallon kit
(clear)
(white)

DA042
DA039

-
-

-
-
100 gallon kit
(clear)
(white)
(black)

DA041
DA040
DA048

-
-
-

-
-
-
Food Grade Pot
& Seal
An epoxy potting compound acceptable for meat and poultry plants. It is ideal for bonding filter screens to frames. 400 ml cartridge DA999 14410 (manual)
14400 (pneumatic)
14292

14292
Tru-Bond® 206A Silver-filled conductive adhesive solder for bonding electrical components where hot solder would damage or fail to bond the metals or wires to be joined as well as for microwave shielding. 10 g 038-206910-10G    
Tru-Bond® 214 Silver-filled epoxy for applications where a conductive bond is required and hot soldering is impractical. A nonsagging paste, it can be used to form conductive paths on circuit boards and to prepare electrodes for capacitance and loss measurements. It also offers high-thermal conductivity and meets federal specification MMM-A-1931.   039-000214-10G    
Tru-Bond® 215 An economical alternative to silver-filled products, Tru-Bond 215 is a copper-filled epoxy that is both electrically and thermally conductive. A nonsagging paste, it can be used to form or repair conductive paths on circuit boards and in heat-sink and RF shielding applications.   039-000215-10G